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Features
NINK®-Ag series, conductive silver ink series of ABC NANOTECH, are devised for convenient use of piezoelectricinkjet printing on the various substrates. NINK®-Ag series aremade up of surface modified nano-silver which is developedby a unique technology of ABC NANOTECH. Fine-pitch conductive lines can be demonstrated on the various plates, such as olycarbonate, polyester, polyimide, and ceramics, by using NINK®-Ag series. Nano-sized silver particles can be sintered at lower temperatures, around 150°C, than microsized silver particles can. NINK®-Ag series are applied to conductive line formation in the shorter process than existing
conductive line formation methods.
Application
- RFID Antennas and Tags
- Multi-Layer Circuit Boards
- Electronic Displays such as PDP, LCD, OLED
- Membrane Keyboard
Advantage
- Achievement of Low Electric Resistivity during Short Processing Time
- Highly Qualified and Fine-Pitch Printing
- Excellent Adhesion to Various Substrate, such as Glass, PI, PC, PET, etc.
Specification
Ink Properties
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NINK-Ag D2011
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NINK-Ag WM2035
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Viscosity
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11.0 cP
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3.5 cP
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Surface Tension
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30 Dynes
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35 Dynes
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Ag Content
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20 wt%
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20 wt%
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Density
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1.23 g/cc
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1.21 g/cc
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Vehicle
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Alcohol
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Water-Miscible Solvent
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Head Compatibility
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Piezo(Xaar)
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Piezo(Epson)
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Ink Performance
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Substrates
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Alumina Plate
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Glass Plate
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Curing Temp.
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350 ~ 580°C in Air
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350~ 580°C in Air
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Curing Time
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30min
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30min
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Bulk Resistivity
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7.5 μΩcm
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3.5 μΩ cm
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Sheet Resistivity
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75~750 mΩ/square
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75~750 mΩ/square
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Fired Print Thickness
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0.2µm
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0.2µm
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Surface and Cross-Section SEM Image of Printed Ink Curing at 350°C after 30 Minutes
Electrical Performance vs. Curing Temperature in Air
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Click to enlarge image 
Origin